SMP Case Histories, Semiconductor The following are examples of Semiconductor
projects competed by SMP.
Click picture for close up view
Back End Chip Processing High Speed
Mechanism SMP
Tech, Inc. was tasked to update an existing product
that offered a better user interface, increased
the throughput all while reducing the overall unit
cost. We met this challenge by applying basic industrial
design and human factors along with engineering
analysis and design principles from the ground up.
The frame was completely redesigned to provide a
stable structure for higher operating speeds. It
also incorporated several features that previously
required several separate parts. In addition, input
from assemblers, service technicians, and customer
service were integrated into the design stage, which
resulted in a system that meets the up front technical
requirements as well as the downstream service and
maintenance personnel. The end result was a system
where throughput increased from 6,000 to over 12,000
units per hour, material cost of the unit was cut
in half, assembly is measured in hours, not days,
and service calls are now dealt with by modular
replacements instead of complete system reworks.
Front End Robot, 200
mm Wafers High Capacity
Wafer Processing SMP Tech,
Inc. designed, documented and built two front end
robotic systems used to load 200 mm wafers into
the vacuum chamber in a microwave asher.
Front
End Robot, 300 mm Wafers High Capacity
Wafer Processing SMP Tech,
Inc. designed, documented and built three front
end robotic systems used to load 300 mm wafers
into the vacuum chamber in a microwave asher.
The robot was specially designed to move 25 wafers
at one time. The entire robotic system was only
thirty six inches deep.
End Effector, 300 mm
Wafers High Speed
Wafer Processing SMP Tech,
Inc. designed this end effector for the front end
robot shown above. The end effector applied vacuum
to all 25 wafers at the same time.
Wafer Cleaning High Energy
Plasma Cleaning This machine
is a example of packaging for a technically advanced
product. Our responsibilities included design,
documentation and the building of the production
systems.
Back End Chip Processing Dynamic Measurement: Intercon had
developed a high speed Singulation System mechanism
with a throughput of 6,000 UPH. In order for SMP
to increase the speed of the system, SMP designed
a new frame structure. We measured the acceleration
forces (greater than 6 G) and the exciting frequencies
to establish the design criteria. SMP used COSMOS
Design Star FEA software, along with the test data,
to guide our frame activities. Operational
Results: Intercon was able to increase their throughput
from 6,000 UPH (units per hour) to over 15,000 UPH.
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